تلخیص
Currently, the employees are facing increasingly the probability of the life-long unemployment. The frequently changing nature of jobs and the challenges involved in the process weakens the relationship between employer and employee. Keeping in view these situations, the present paper attempts to scrutinize and examine the factors responsible for the development of individuals’ affective commitment towards the respective organizations. For that, a conceptual framework was developed on the basis of literature reviewed. A survey questionnaire is applied to get the response for the affective commitment and dispositional traits and the respondents being the doctors of the public health sector of Pakistan. At the initial stage, 1000 questionnaires were randomly distributed through personal visits and mail services such as Pakistan post and TCS limited service of Pakistan. From them, in total, 436 questionnaires were returned. The response rate is 43%. Statistical Package for Social Sciences (SPSS) version 21.0 is used for data analysis. After data cleaning and screening, 404 samples were utilized for final usage. The outcomes of Pearson’s correlation and multiple regression analysis highlighted that dispositional affectivity (positive and negative) and affective commitment are significantly and positively correlated with each other. The positive results would be helpful for the management and those who are one way or the other, the part of HR and the organizational behavior that checks the employees’ commitment within their respective organizations. Furthermore, it may show to be an advice for Pakistan for improving organizations through upgradation of such factors which are really predict the organizational commitment among the employees. Finally, it may contribute to the domain of literature pertaining to the organizational commitment
particularly for developing countries
Abdul Wahid1, Dr. Naimatullah Shah2, Dr Mohammad Baksh Burdey3. (2018) Linking dispositional traits to affective commitment, Balochistan Review, Volume 2 , Issue 2.
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