Abstract
The Information Technology field has characteristics that make for a unique working environment. This paper presents a study conducted among the Information Technology (IT) employees working at the Ministry of the Turkish Government, which examined the relationship between the constructs; person organization fit, organizational identification, organizational commitment and job satisfaction. First, these constructs were briefly discussed, then the hypotheses were developed based on the relevant literature and the hypotheses were tested in a sample of the IT professionals. IT professionals’ level of organizational commitment and job satisfaction is important in minimizing turnover, improving job performance, minimizing absenteeism, and increasing the level of job involvement. One hundred and forty seven employees of a Ministry filled out the questionnaire. It was determined that there were positive relations between organizational commitment and organizational identification, person organization fit and job satisfaction. Furthermore, positive correlations were determined between organizational commitment and organizational identification, person-organization fit and job satisfaction. The data compiled within the scope of the study were analyzed and interpreted in line with the determined objectives by using the descriptive statistics and employing frequency analysis, correlation and regression analyses. Limitations of the study are also presented along with future research recommendations. IT managers can use this information to increase employee organizational commitment and job satisfaction by considering person - organization fit, and organizational identification when making project assignment and job/work design decisions.

EDİP SABAHATTİN METE, ALPTEKİN SÖKMEN, YUNUS BIYIK. (2016) The Relationship between Organizational Commitment, Organizational Identification, Person-Organization Fit and Job Satisfaction: A Research on IT Employees, International Review of Management and Business Research, Volume 5, Issue 3.
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